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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment
EM-250K
EM-247
EM-290
EM-6320

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Laser Processing Equipment EM-290


Laser Processing Equipment EM-290 is intended for drilling holes in dice made of piezoelectric quartz, lithium niobate, lithium tantalat, langasite, langatate, alumina ceramics without any changes in the die physical characteristics as well as for laser cutting of microsystem equipment wafers.

 The system is designed for enterprises, producing microelectronics.

Wafer thickness from 150 to 1000 mkm
Working area 150150 mm
Minimal diameter of the hole 0.1 mm
Repeatability of the hole lines position No more than 0.005 mm
For wafers from piezomaterials: difference between the inlet and outlet hole No mare than 5 %
Shear size, max No more than 4 %
Drilling time of the hole with diameter 100 mkm in pizoquartz wafer with thickness 0.5 mm No more than 30 s
Coordinate table travel accuracy on 150 mm 0.004 mm
Minimal travel discretion X, Y No more than 0.001 mm
Repeatability of coordinate table travel on X, Y No more than 0.004 mm
Power requirements and consumption 400V; 50Hz; 3kW
Overall dimensions 2360x1100x1500 mm
Weight 1980 kg

Russian version
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