Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services Support

Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


Laser Treatment System EM-250K

The system is intended for silicon wafer scribing, as well as for through cutting along the preset contour and drilling holes in wafers made of alumoceramics, silicon and other materials used in microelectronics.

The wafer thickness is up to 2mm.

The system consists of:
- positioner;
- solid laser, consisting of the radiator, power supply unit and cooling unit;
- optical mechanical system;
- laser power control system;
- operating system, based on IBM PC computer;
- technological process software;
- body with protective covers and lockout system.

Laser type Nd:YAG with diode pumping
Average capacity 10-25 W
Working zone 150 x 150 mm
Accuracy 5 mkm
Linear speed up to 400 mm /s
Theta displacement 360
Power requirements and consumption 230 V, 50 Hz, 6.5 kW
Overall dimensions 1870x840x1300 mm
Weight 600 kg

Russian version
Planar Holding
Site Search
Select a model

Other models of this section

2003 Planar
e-mail: Web design and