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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment
EM-250K
EM-247
EM-290
EM-6320

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Laser Treatment System EM-250K



The system is intended for silicon wafer scribing, as well as for through cutting along the preset contour and drilling holes in wafers made of alumoceramics, silicon and other materials used in microelectronics. The wafer thickness is up to 2mm.

   The system consists of:

-  positioner;

-  solid laser, consisting of the radiator, power supply unit and cooling unit;

-  optical mechanical system;

-  laser power control system;

-  operating system, based on IBM PC computer;

-  technological process software;

-  body with protective covers and lockout system.

 

Laser type Nd:YAG with diode pumping
Average capacity 10-25 W
Working zone 150 x 150 mm
Accuracy 5 mkm
Linear speed up to 400 mm /s
Theta displacement 360
Power requirements and consumption 230 V, 50 Hz, 6.5 kW
Overall dimensions 1870x840x1300 mm
Weight 600 kg

Russian version
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