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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment



The encapsulation system is intended for die encapsulation with compound on a PCB (substrate).

The heated compound is mechanically pressed out of a dispenser fastened on a three-coordinate table (100x200mm) having a step drive, and is applied according to a programmed contour.

The heating temperature of the PCB and compound is set and maintained by thermocontrollers.

PCB dimensions 100x200 mm
XY PCB travel area 175x175 mm
XY compound application accuracy, not more than 0.8 mm
Minimal compound layer thickness 0.4 mm
Heating temperature of PCB and compound 40 150
Encapsulation time for a 10x10 mm area with compound layer thickness 0.4 mm, no more than 12 s
Power requirements and consumption 230 V, 50 Hz, 1.5 kW
Overall dimensions 1100x1000x1500 mm
Weight 200 kg

Russian version
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