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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

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Photorepeaters

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Large-area steppers

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Tools for proximity exposure and double-side lithography

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Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

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IC Pretreatment Equipment
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Microscopy

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The encapsulation system is intended for die encapsulation with compound on a PCB (substrate).

The heated compound is mechanically pressed out of a dispenser fastened on a three-coordinate table (100x200mm) having a step drive, and is applied according to a programmed contour.

The heating temperature of the PCB and compound is set and maintained by thermocontrollers.

SPECIFICATIONS
PCB dimensions 100x200 mm
XY PCB travel area 175x175 mm
XY compound application accuracy, not more than 0.8 mm
Minimal compound layer thickness 0.4 mm
Heating temperature of PCB and compound 40 150
Encapsulation time for a 10x10 mm area with compound layer thickness 0.4 mm, no more than 12 s
Power requirements and consumption 230 V, 50 Hz, 1.5 kW
Overall dimensions 1100x1000x1500 mm
Weight 200 kg

Russian version
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