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EM-4451
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Discrete Cases Wire Bonder EM-4451


Discrete Cases Wire Bonder EM-4451 is intended for automatic bonding of gold wires in semiconductor equipment using the thermosonic ball-to-wedge bonding method.

The system is equipped with:
- modern operation system with the use of foreign completing units;
- modern software;
- modern optical television system;
- fast machine vision system (MVS).

The system is equipped with retracktable drive on X, Y, Z working travel axes.

The system consists of:
Control stand - 1 pc.
Wire bonding micro instrument 1 pc.
USG/ FBB control unit - 1 pc.
TV-monitor- 1 pc.

SPECIFICATIONS
Working area 200x150 mm
Wire diameter 0.0170.050 mm
Bonding accuracy 0.005 mm
Number of wires not limited
Max number of dice in one product for bonding 200 pcs.
Bonding force 0.22.5H 10%
Contact recognition as a part of bonding system
Wire grip drive electro-magnetic
Bonding pulse duration 0.0010.255 s
Bonding pulse discretion 0.001 s
USG output power (regulated) no more than 4 W
Power consumption and requirements 230V, 50Hz,12 kW
Overall dimensions (L×W×H) 1200×800×1500 mm
Weight 300 kg

Russian version
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