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Equipment for mask pattern generation and inspection

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Wire Bonders
EM-4450
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EM-4320

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Discrete Cases Wire Bonder EM-4450


Discrete Cases Wire Bonder EM -4450 is intended for automatic bonding of gold wires in semiconductor equipment using the thermosonic ball-to-wedge bonding method.

The system is equipped with:

- modern operation system with the use of foreign completing units;

- modern software;

- modern optical television system;

- fast machine vision system(MVS);

The system is equipped with retracktable drive on X, Y, Z working travel axes.

 

The system consists of:

Control stand - 1 pc.

Wire bonding micro instrument 1 pc.

USG/ FBB control unit - 1 pc.

TV-monitor- 1 pc.

Working area, mm 200x150
Wire diameter, mm 0.0170.050
Bonding accuracy, mm 0.005
Number of wires, max, pc. not limited
Max number of dice in one product for bonding, pcs. 200
Bonding force, N 0.22.5 10%
Contact recognition as a part of bonding system
Wire grip drive electro-magnetic
Bonding pulse duration, s 0.0010.255
Bonding pulse discretion, s 0.001
USG output power (regulated), W no more than 4
Power consumption and requirements 230V, 50Hz,12 kW
Overall dimensions (L×W×H), mm 1200×800×1500
Weight, kg 300

Russian version
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