Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services Support

Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


Automatic Ultrasonic Wire Bonder EM-4371

The EM-4371 Automatic Wire Bonder is designed for automatic aluminum and gold ultrasonic wedge bonding of a wide variety of devices requiring large working area and high bonding accuracy, including multiwire, multichip and multilevel hybrids.

The system is equipped with color LCD display and microscope with adjustable focal distance. The system is equipped with illumination system (red/ white), that guarantees even illumination of the working space.

A low mass rotating bondhead separated from X, Y, Z drives ensures required wire looping contour, reduces impact of mechanical vibrations on the bonding tool, allowing soft touch. It improves bonding quality. Ultrasonic generator is equipped with the control system and set-up parameters stabilization system; micro bonding with fanding in acoustic impulse capacity can also be carried out.

The bonder provides:
- automatic detection of bonding pads and package lead locations including multilevel devices;
- programming of bonding parameters and loop shape for each wire;
- versatile bonding system owing to the large working area and waffle packs;
- self-diagnosis of the main functional units;
- control system of wire add disconnection;
- system for statistic accumulation and analysis in case of failure, which facilitates the system operation.

The system construction is convenient and practical; as distinct from the majority of foreign systems the operator can sit while working.

Bonding speed (wire no more than 2 mm long) 0.33 s
Wire diameter from 0.02 to 0.05 mm
X-Y working area 200100 mm
Bond force from 0.2 to 0.8 N
Number of wires (max for one cycle) 1000
Welding head turn angle 370º
Bond pulse duration from 0.001 to 0.25 s
US generator output power from 0.1 to 4 W
US generator working frequency from 60.5 to 70 kHz
Power requirement 230 V, 50 Hz, 1.0 kW
Overall dimensions 1200x770x2000 mm

Russian version
Planar Holding
Site Search
Select a model

Other models of this section

2003 Planar
e-mail: Web design and