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EM-4450
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Automatic Ultrasonic Wire Bonder EM-4370


 

The EM-4370 Automatic Wire Bonder is designed for automatic aluminum and gold ultrasonic wedge bonding of a wide variety of devices requiring large working area and high bonding accuracy, including multiwire, multichip and multilevel hybrids.

The system is equipped with color LCD display and microscope with adjustable focal distance. The system is equipped with illumination system (red/ white), that guarantees even illumination of the working space.

A low mass rotating bondhead separated from X, Y, Z drives ensures required wire looping contour, reduces impact of mechanical vibrations on the bonding tool, allowing soft touch. It improves bonding quality.

 

Ultrasonic generator is equipped with the control system and set-up parameters stabilization system; micro bonding with fanding in acoustic impulse capacity can also be carried out.

 

The bonder provides:

- automatic detection of bonding pads and package lead locations including multilevel devices;

- programming of bonding parameters and loop shape for each wire;

- versatile bonding system owing to the large working area and waffle packs;

- self-diagnosis of the main functional units;

- control system of wire add disconnection;

- system for statistic accumulation and analysis in case of failure, which facilitates the system operation.

 

The system construction is convenient and practical; as distinct from the majority of foreign systems the operator can sit while working.

 

Bonding speed (wire no more than 2 mm long) 0.33 s
Wire diameter from 0.02 to 0.05 mm
X-Y working area 200100 mm
Bond force from 0.2 to 0.8 N
Number of wires (max for one cycle) 1000
Welding head turn angle 370º
Bond pulse duration from 0.001 to 0.25 s
US generator output power from 0.1 to 4 W
US generator working frequency from 60.5 to 70 kHz
Power requirement 230 V, 50 Hz, 1.0 kW
Overall dimensions 1200x770x2000 mm

Russian version
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