Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services Support


Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders
EM-4451
EM-4020PM
EM-4371
EM-4340A1
EM-4320U
EM-4320

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

Ultrusonic Wire Bonder EM-4340A1


Ultrasonic Wire Bonder EM-4340-1 is intended for ultrasonic bonding of aluminium wires to contact pads of semiconductor device dice (transistors, Ics, etc.).

The welding head, which turns by φ angle and travels along X, Y and Z axis, has stepper drive system and provides for discrete tools bonding as well as cut off strips bonding.

The system is equipped with bonding control system.

The basic parameters of the technological process (travel speed, bond force, time, etc.) can be programmed. Feed of the frames in process (products) is push-up store with changeover.

The push-up store replacing can be exercised by hand without the system standstill.

The system has the possibility to bond wires of different length, bonding levels, number of loop stitches, including wire bonding in excess up to 30mm.

Coordinate input of the die weld spot and the case leads is performed due to self-teach method, that gives the operator an opportunity of programming for a new kind of product.

SPECIFICATIONS
Aluminium wire diameter 100500 mkm
Wire add production cycle automatic
Lead cutting from wire with knife semiautomatic, lead-in cut with knife, cut with the table
Bond direction die-traverse, traverse-die, die-die
Multidie bonding automatic
Adjustment to the contact pads automatic
Tool feed and fixation automatic
Throughput 0.8 s (wire add formation time, wire diameter is 200mkm, wire add length is 5mm)
Multistitch bonding as programmed
Wire bonding in excess yes
Wire add bonding with the turn up to + 900 from the bonding direction yes
Bond force 1.530 N
USG:
Frequency 666,6 kHz
Bond impulse duration 0.011 s
Power consumption from 0.4 to 40 W
Weight 250 kg

Russian version
PLANAR
Planar Holding
Site Search
 
Select a model


Other models of this section

2003 Planar
e-mail: planar_ovep@kbtem.by

www.redgraphic.com Web design and
development