Automatic Die Bonders EM-4320 are intended for wire bonding in a wide range of electronic items. There are a few modifications of EM-4320, such as:
Automatic Die Bonder EM-4320-1 is intended for thermosonic ball-to-wedge wire bonding of gold wires.
Automatic Die Bonder EM-4320-2 - is intended for ultrasonic/thermosonic wedge-to-wedge wire bonding of aluminium and gold wires.
Automatic Die Bonder EM-4320-3 is intended for ultrasonic wedge-to-wedge wire bonding of thick aluminium wire with diameter from 100 to 500 mkm.
Automatic Die Bonder έΜ-4320-4 is intended for bonding of wires of gold (copper, platinum, palladium, etc.) using the contact bonding wedge-to-wedge method.
The alignment of the first bonding pad with the bonding tool as well as loop direction and, if needed, subalignment of the second contact pad is to be done manually by means of a manipulator-microscope-light pointer system (in EM-4320-1,2,3,4).
Loop bonding and loop forming, ball forming at the end of gold wire (EM-4320-1), wire cut-off from the loop are all automatic as per preset cycle.
Loop forming & bonding parameters are to be preset by means of a keyboard and can be viewed on a mini LCD display.
The systems provide for wire bonding as well as for using spot bonding for the ready wire adjustment.
The ball-forming unit and the ultrasonic generator are equipped with inspection and regulation systems of preset parameters.