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Die Bonders

Wire Bonders
EM-4450
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EM-4370
EM-4340A1
EM-4320U
EM-4320

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Universal Wire Bonder EM-4320


Automatic Die Bonders EM-4320 are intended for wire bonding in a wide range of electronic items. There are a few modifications of EM-4320, such as:

Automatic Die Bonder EM-4320-1 – is intended for thermosonic ball-to-wedge wire bonding of gold wires.

 Automatic Die Bonder EM-4320-2 - is intended for ultrasonic/thermosonic wedge-to-wedge wire bonding of aluminium and gold wires.

Automatic Die Bonder EM-4320-3 – is intended for ultrasonic wedge-to-wedge wire bonding of thick aluminium wire with diameter from 100 to 500 mkm.

Automatic Die Bonder έΜ-4320-4 – is intended for bonding of wires of gold (copper, platinum, palladium, etc.) using the contact bonding wedge-to-wedge method.

The alignment of the first bonding pad with the bonding tool as well as loop direction and, if needed, subalignment of the second contact pad is to be done manually by means of a manipulator-microscope-light pointer system (in EM-4320-1,2,3,4).

Loop bonding and loop forming, ball forming at the end of gold wire (EM-4320-1), wire cut-off from the loop are all automatic as per preset cycle.

Loop forming & bonding parameters are to be preset by means of a keyboard and can be viewed on a mini LCD display.

The systems provide for wire bonding as well as for using spot bonding for the ready wire adjustment.

The ball-forming unit and the ultrasonic generator are equipped with inspection and regulation systems of preset parameters.

 

 

*    The system can be delivered with a stage that has a working area of up to Æ 150 mm as well as with a stage that features mechanized feed of items in a carrier.

**     Possible manual adjustment of bonding level up to 10 mm.  

        ***   Possible reinforcement of overlapped bonding by means of a bonded ball.
Parameters EM-4320-1 EM-4320-2 EM-4320-3 EM-4320-4
Boding method Thermosound Ultrasound/thermosound Ultrasound Contact bonding
Wire material Au Al / Au Al Au / Cu, Pl, Pa
Working area size * 65 x 65 65 x 65 65 υ 65 65 υ 65
Round wire size, mm 0.017 – 0.075 Au: 0.017 – 0.075; Al: 0.020 – 0.080 0.08 – 0.5 0.02 – 0.1
Flat wire size, mm – – – 0.02-0.03 υ 0.1-0.2
Loop forming Automatic Automatic Automatic Automatic
Bonding technique Butt-to-butt - overlapping Overlapping Overlapping Overlapping
Bonding force, N 0.1 – 1.5 0.1 – 1.5 1 – 12 0.15 – 2.0
Operation cycle time, sec 0.8 0.8 1.0 0.8
Alignment working area, dia:
- coarse (manual), mm 85 85 85 85
- fine (manipulator), mm 15 15 15 15
Tool temperature, °Ρ Up to 300 Up to 300 Has temperature controller Up to 300 / —
Bond location height difference, mm ** ± 1 mm ± 1 mm ± 1 mm ± 1 mm
Number of stitches in a loop – Up to 9 Up to 9 Up to 9
Bond pulse forming unit output/operation frequency, W/kHz Up to 4 /90…100 Up to 4 /90…100 Up to 40 /66 –
Bonding pulse duration, sec 0.01 – 0.250 0.001 – 0.255 0.01 – 0.999 0.01 – 0.999
Wire feed angle:
- main 90° 30° 30° 30°
- additional – – 60° –
Tool penetration depth, mm 6 14 (without clamping jaws) 6 (60°) 31(without clamping jaws)
Power requirements and consumption 230V; 50Hz; 0.3 kW 230V; 50Hz; 0.3 kW 230V; 50Hz; 0.3 kW 230V; 50Hz; 0.4 kW
Overall dimensions (mm) and weight(kg) 750x750x600 / 40 750υ750υ600 / 35 750υ750υ600 / 42 750υ750υ600 / 40

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