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The EM-4320U Universal Wire Bonder

The EM-4320U Universal Wire Bonder is a development of JSC "Planar-CO", which has more than 50 years of experience in the development and production of assembling equipment for the microelectronics.

The system has tremendous opportunities for wire bonding, it provides bonding the electronic products to the contact platforms by "wedge-wedge" and "ball-wedge" methods, using use thermosonic, ultrasonic and contact welding.

The universality of this system is provided by a 'portal' location of welding system towards workpiece, integrated technology blocks and quick-welding heads for each type of welding. There is ability to provide the system with the TV system for simplification of control of wire bonding.

Combining the first contact platform and welding tool, direction of the bulkhead, and, if it is necessary, additional combining second contact platform is performed by hand with help of system "Manipulator - Microscope - LED Pointer".

Gold wire diameter 0.0170.075 mm
Golden ribbon cross-section (0.020.03)(0.10.25) mm
Aluminum wire diameter 0.020.08 mm
Aluminum wire cross-section (0.020.03)(0.10.25) mm
Working platform diameter of rough movement of the table 150 mm
Diameter of accurate movement of the table 15 mm
Movement of the welding tool along Z-axis to 15 mm
Managed strength of compression of connected elements:
static (without spring) 0.1-2.5 H
electromagnetic 0.03-0.1 (of/from set static) H
Output power of ultrasonic generator from 0.1 to 2.5 W
Managed welding time 0.001- 0.255 s
Diameter of melted ball managed by wire diameter from 1.8 to 2.5 Ø wire
Range of regulation of heating temperature of the tables work area from 25 to 300º
Output power of contact welding block from 2.5 to 125 W
Overall dimensions 700700700 mm
Weight, max 52 kg

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