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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection


Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components


Optical Components

Medical Equipment


Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors


Linear Step Motors

Step Motors, Sensors

The EM-4320U Universal Wire Bonder


The EM-4320U Universal Wire Bonder is a development of JSC "Planar-CO", which has more than 50 years of experience in the development and production of assembling equipment for the microelectronics.

The system has tremendous opportunities for wire bonding, it provides bonding the electronic products to the contact platforms by "wedge-wedge" and "ball-wedge" methods, using use thermosonic, ultrasonic and contact welding.

The universality of this system is provided by a 'portal' location of welding system towards workpiece, integrated technology blocks and quick-welding heads for each type of welding.

There is ability to provide the system with the TV system for simplification of control of wire bonding. Combining the first contact platform and welding tool, direction of the bulkhead, and, if it is necessary, additional combining second contact platform is performed by hand with help of system "Manipulator - Microscope - LED Pointer".


Gold wire diameter, mm 0.0170.075
Golden ribbon cross-section, mm (0.020.03)(0.10.25)
Aluminum wire diameter, mm 0.020.08
Aluminum wire cross-section, mm (0.020.03)(0.10.25)
Working platform diameter of rough movement of the table, mm 150
Diameter of accurate movement of the table, mm 15
Movement of the welding tool along Z-axis, mm to 15
Managed strength of compression of connected elements:
static (without spring), H 0.1-2.5
electromagnetic, H 0.03-0.1 (of/from set static)
Output power of ultrasonic generator, W from 0.1 to 2.5
Managed welding time, c 0.001- 0.255
Diameter of melted ball managed by wire diameter, Ø wire from 1.8 to 2.5
Range of regulation of heating temperature of the tables work area, º from 25 to 300
Output power of contact welding block, W from 2.5 to 125
Overall dimensions, mm 700700700
Weight, max, kg 52

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