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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders
EM-4450
EM-4020PM
EM-4370
EM-4340A1
EM-4320U
EM-4320

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Wire Bonders


 

EM-4450 

Discrete Cases Wire Bonder EM-4450 is intended for automatic bonding of gold wires in semiconductor equipment using the thermosonic ball-to-wedge bonding method.

 

EM-4020PM 

Automatic Wire Bonder EM-4020PM is the newest development project of the UE KBTEM-SO, which is intended for connection bonding wires of aluminum to the contact platforms of the crystal and hull by ultrasonic welding.

EM-4370

E-4370 is designed for automatic ultrasonic aluminum wedge bonding of a wide variety of devices requiring a large working area and high bond accuracy, including multichip and multilevel hybrids

EM-4340-A1

E-4340-1 is designed for automatic ultrasonic bonding of aluminium wires of increased diameter to pads of power transistors, hybrid ICs and power modules

EM-4320U

The EM-4320U Universal Wire Bonder is a new development of scientific-production enterprise "KBTEM-CO", which has more than 45 years of experience in the development and production of assembling equipment for the microelectronics.

 

 

EM-4320-1, EM-4320-2, EM-4320-3, EM-4320-4

Universal Wire Bonder is designed for thermosonic bonding of gold wires

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