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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders
EM-4451
EM-4020PM
EM-4371
EM-4340A1
EM-4320U
EM-4320

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

Wire Bonders


EM-4451

Discrete Cases Wire Bonder EM-4451 is intended for automatic bonding of gold wires in semiconductor equipment using the thermosonic ball-to-wedge bonding method.

EM-4020PM

Automatic Wire Bonder EM-4020PM is the newest development project of the UE KBTEM-SO, which is intended for connection bonding wires of aluminum to the contact platforms of the crystal and hull by ultrasonic welding.

EM-4371

E-4371 is designed for automatic ultrasonic aluminum wedge bonding of a wide variety of devices requiring a large working area and high bond accuracy, including multichip and multilevel hybrids

EM-4340-A1

E-4340-1 is designed for automatic ultrasonic bonding of aluminium wires of increased diameter to pads of power transistors, hybrid ICs and power modules

EM-4320U

The EM-4320U Universal Wire Bonder is a new development of scientific-production enterprise "KBTEM-CO", which has more than 45 years of experience in the development and production of assembling equipment for the microelectronics.

EM-4320-1, EM-4320-2, EM-4320-3, EM-4320-4

Universal Wire Bonder is designed for thermosonic bonding of gold wires


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