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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection


Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components


Optical Components

Medical Equipment


Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors


Linear Step Motors

Step Motors, Sensors

Die Bonder EM-4075-1


The EM-4075A-1 Die Bonder is designed for bonding semiconductor chips in production of integrated circuits, hybrids, UHV-transistors, diode and transistor assemblies and other electronic devices by vibration eutectic soldering in manual mode.

The bonder is a desk-top version.

The system has following features: a scrubbing die bond head with a tool heater, heated work stage, gas heater for soldering in a protective gas environment, an object stage for the dice in bulk, light indicator.

The pick up of the dice is carried out by vacuum from the object stage or from a multi-row cellular cassette. The cases or substrates are placed discretely into working area of the heated table.



The size of the merged dies from 0,4x0,4mm to 10x10mm
The minimum height of the die 0,1 mm
Tool vibration amplitude from 0.1 to 0.25 mm
Tool vibration frequency from 2 to 10 Hz
Vacuum from 25 to 30 kPa
Power consumption and requirements 230 V, 50/60 Hz, 0.5 kW
Overall dimensions 525x450x525 mm
Weight 25 kg
The ability to offset the angle f of the die attaching, manual alignment of a desk by the angle f when viewed under a microscope and a pantograph along the x, y
Compression load adjustable
Control range compression force 1-2,5

Russian version
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