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Equipment for mask pattern generation and inspection

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Die Bonders
EM-4105
E-4685
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EM-4025M-3
EM-4075-1

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Die Bonder E-4685


Die Bonder EM-4685 is intended for the bonding of dice to the bodies of high power transistors -220 or -218 with solder alloy in the protective unit.

SPECIFICATIONS
Working cycle time (excluding the bonding time) 0.7 sec
Die size 1x1 10x10 mm
Bonding accuracy:
- on X,Y axes 0.1 mm
- angle φ 5
Wafer diameter, max 200 mm
Frame type TO-218, TO-220
Power requirements and consumption 230V, 50Hz, 7.5kW
Overall dimensions 1650x950x1870 mm
Weight 600 kg

Russian version
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