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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders
EM-4585
EM-4105
E-4685
E-4505
EM-4336
EM-4025M-3
EM-4075-1

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Die Bonder E-4685


Die Bonder EM-4685 is intended for the bonding of dice to the bodies of high power transistors -220 or -218 with solder alloy in the protective unit.

Working cycle time (excluding the bonding time) 0.7 sec
Die size 1×1 10×10 mm
Bonding accuracy:
- on X,Y axes +- 0.1 mm
- angle φ +- 5
Wafer diameter, max 200 mm
Frame type TO-218, TO-220
Power requirements and consumption 230V, 50Hz, 7.5kW
Overall dimensions 1650×950×1870 mm
Weight 600 kg

Russian version
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