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Die Bonder VLSI EM-4585

Die Bonder EM-4585 is intended for automatic bonding of semiconductor equipment dice to the frame with the use of glue.

The frame feed, glue application, wafer orientation, search of the first and subsequent good dice, dice bonding and bonded dice control are carried out automatically.

Machine vision system provides for the good dice selection conforming to the following requirements: absence of marking spot, splits, shears, as well as recognition of the bonding point and the bonded dice control.

Loading device puts the frame on the track from the pile (cassette) and feeds to the working positions of applying glue, die bonding and the bonded dice control.

Metering system is presented by pneumodosimeter, placed on the three- axes table, which provides for the application of one blob of glue of the definite shape and also application of glue according to the set pattern.

Highly productive three-coordinate X, Y, Z tool travel drive is equipped with the feedback, which allows for bonding dice with high accuracy.

Loading system and pick-up tool on the base of Voice coil motor provide for die removal with controlled force.

Control system and software are produced on the base of the PC-compatible industrial computer and Microsoft Windows operation system in real time mode, so that it provides for the realization of the modern operation interface.

Throughput 5000 dice/hour
Die bonding cycle time (for dice of 1.5x1.5 mm) 0.45 s
Wafer diameter up to 300 mm
Die size from 0.8x0.8 to 20x20 mm
Bonding method glue
Bonding force from 0.3 to 1.5 N
Bonding accuracy:
on X, Y axes 0.025 mm
angle 2.5
Power requirements:
from three-wire system with earth tension wire 230V/50Hz
Compressed air 0.5 0.6 MPa
Vacuum with residual pressure 0.02 0.04 Mpa
Power consumption (max) 1.5 kW
Overall dimensions:
length 1800 mm
width 1300 mm
height 1995 mm
Weight 780 kg

Russian version
Planar Holding
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