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Equipment for mask pattern generation and inspection

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Die Bonders
EM-4105
E-4685
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EM-4025M-3
EM-4075-1

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Die Bonder with Flip-chip Technology EM-4336


The system is intended for automatic bonding of reversed dice outputs to the substrate to produce electronic equipment. The system carries out die adjustment with large indium outputs to the contact wafers using bonding method. There is an option of bonding dice with gold ball outputs. Substrate material: quartz, lithium niobate, lithium tantalat, langasite, langatate.

SPECIFICATIONS
Die size range from 1 1 to 15 15
Number of simultaneously bonded outputs Up to 512
Size of substrate 150x150 mm
Size of wafer Ø 76, 100, 150 mm
Continuous operation time 24 hour
Kinematic throughput with the adjustment time no more than 2 s No less than 500 dice/hour
Working table heating temperature From plus 50 to plus 400º
Tool heating temperature From plus 50 to plus 120º
Tool load force From 2 to 100 N
Die bonding accuracy to the substrate ≤ 5050 mm 10 mkm
Compressed air pressure From 0.5 to 0.6 MPa
Vacuum line with residual pressure 0.0 0.04 MPa
Industrial gas azote pressure From 0.11 to 0.2 MPa
Power requirements and consumption 230 V, 50 Hz, 2.5 kW
Overall dimensions 11509501900mm
Weight 450 kg

Russian version
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