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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

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Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

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Die Bonder with Flip-chip Technology EM-4336

The system is intended for automatic bonding of reversed dice outputs to the substrate to produce electronic equipment. The system carries out die adjustment with large indium outputs to the contact wafers using bonding method. There is an option of bonding dice with gold ball outputs. Substrate material: quartz, lithium niobate, lithium tantalat, langasite, langatate.

Die size range from 1 1 to 15 15
Number of simultaneously bonded outputs Up to 512
Size of substrate 150x150 mm
Size of wafer Ø 76, 100, 150 mm
Continuous operation time 24 hour
Kinematic throughput with the adjustment time no more than 2 s No less than 500 dice/hour
Working table heating temperature From plus 50 to plus 400º
Tool heating temperature From plus 50 to plus 120º
Tool load force From 2 to 100 N
Die bonding accuracy to the substrate ≤ 5050 mm 10 mkm
Compressed air pressure From 0.5 to 0.6 MPa
Vacuum line with residual pressure 0.0 0.04 MPa
Industrial gas azote pressure From 0.11 to 0.2 MPa
Power requirements and consumption 230 V, 50 Hz, 2.5 kW
Overall dimensions 11509501900mm
Weight 450 kg

Russian version
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