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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders
EM-4585
EM-4105
E-4685
E-4505
EM-4336
EM-4025M-3
EM-4075-1

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

EM-4105 Die Bonder


 

Die Bonder EM-4105 is intended for automatic bonding of dice on the frame using the method of boarding on the electrically conductive glue.

Original machine vision system with the enterprise software is used in the system. The machine vision system identifies whether the die, placed in carrier travel tool is good (absence of marking spots, cracks and shears) and determines its mismatching in relation to the pick-up position.

On the customer demand the system can be transformed for die bonding on eutectic.

Throughput up to 2500 dice/hour (depending on the dice size)
Cycle time 0.9 s/dice
Wafer diameter up to 150 mm
Bonding accuracy:
On X, Y axes 0.1 mm
Angle φ 5 degree
Dice size 0.36 0.36 . . . 3.0 3.0 mm
Bonding duration 0.1. . . 0.9 s
Bonding force 0.2 . . 1.2 N
Consumption:
Compressed air pressure 6.0 kg/cm2
Vacuum with residual pressure 0.6 kg/cm2
Power requirements and consumption 230 V, 50/60 Hz, 1 kW
Overall dimensions 1250740 1740 mm
Weight, no more than 500 kg

Russian version
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