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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


EM-4105 Die Bonder

Die Bonder EM-4105 is intended for automatic bonding of dice on the frame using the method of boarding on the electrically conductive glue.

Original machine vision system with the enterprise software is used in the system.

The machine vision system identifies whether the die, placed in carrier travel tool is good (absence of marking spots, cracks and shears) and determines its mismatching in relation to the pick-up position.

On the customer demand the system can be transformed for die bonding on eutectic.

Throughput up to 2500 dice/hour (depending on the dice size)
Cycle time 0.9 s/dice
Wafer diameter up to 150 mm
Bonding accuracy:
On X, Y axes 0.1 mm
Angle φ 5 degree
Dice size 0.36 0.36 . . . 3.0 3.0 mm
Bonding duration 0.1. . . 0.9 s
Bonding force 0.2 . . 1.2 N
Compressed air pressure 6.0 kg/cm2
Vacuum with residual pressure 0.6 kg/cm2
Power requirements and consumption 230 V, 50/60 Hz, 1 kW
Overall dimensions 1250740 1740 mm
Weight, no more than 500 kg

Russian version
Planar Holding
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