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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

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Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

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Wafer Bonders

IC Pretreatment Equipment

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Microelectronics Microscopes

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Medical Equipment


Die Bonder EM-4025M-3

EM-4025-3 Die Bonder is intended for eutectic, epoxy or soft solder bonding semiconductor chips and components in production of ICs, hybrids, diode and transistor arrays, microwave devices, and other multichip devices.

The minimum chip size is 0.40.4mm, the maximum size is 10x10 mm.
The bonding dies a rates from 1:1 to 1:15.
The bonder is provided with a 8-tool turret-style bond head, heated workholder with two-zone heating, epoxy pneumatic dispenser.
Z-drive ensures soft touching-down required for attaching AIIIBV devices.

Kinematic performance 2000 dice/h
Die size from 0.4×0.4 to 10×10 mm
The minimum height of the die 0,1 mm
Number of die holding tools 8
Repeatability of coordinate table positioning on axis X, Y 5 mkm
Stage travel area 400×200 mm
Regulation diapason of joining elements pressure 0.8 5.0
Working area temperature range (for every area) from 20 to 450
Turret head positioning accuracy along Z axis in the travel range from 0 to 9 mm 0.05mm
Die bonding accuracy:
- along the axes X, Y 0.055mm
- angle 5
Power consumption max 0,6 kW
Overall dimensions 790x780x500 mm

Russian version
Planar Holding
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