Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services Support


Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders
EM-4105М
EМ-4685
EМ-4505
EM-4336
EM-4025АM-3
EM-4075А-1

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

Die Bonders


EM-4105M

Die Bonder EM-4105М is intended for automatic bonding of dice on the frame using the method of boarding on the electrically conductive glue.

EM-4685

Die Bonder EM-4685 is intended for the bonding of dice to the bodies of high power transistors ТО-220 or ТО-218 with solder alloy in the protective unit.

EM-4505

Die Bonder EM-4505 is intended for automatic die bonding with glue while producing semiconductor equipment in ceramic bodies with the use of satellite cassettes.

EM-4336

The system is intended for automatic bonding of reversed dice outputs to the substrate to produce electronic equipment.

EM-4025AM-3

EM-4025АМ-3 Die Bonder is intended for eutectic, epoxy or soft solder bonding semiconductor chips and components in production of ICs, hybrids, diode and transistor arrays, microwave devices, and other multichip devices.

EM-4075A-1

The EM-4075A-1 Die Bonder is designed for bonding semiconductor chips in production of integrated circuits, hybrids, UHV-transistors, diode and transistor assemblies and other electronic devices by vibration eutectic soldering in manual mode.


Russian version
PLANAR
Planar Holding
Site Search
 

© 2003 Planar
e-mail: planar_ovep@kbtem.by

www.redgraphic.com Web design and
development