Die Bonder EM-4105М is intended for automatic bonding of dice on the frame using the method of boarding on the electrically conductive glue.
Die Bonder EM-4685 is intended for the bonding of dice to the bodies of high power transistors ТО-220 or ТО-218 with solder alloy in the protective unit.
Die Bonder EM-4505 is intended for automatic die bonding with glue while producing semiconductor equipment in ceramic bodies with the use of satellite cassettes.
The system is intended for automatic bonding of reversed dice outputs to the substrate to produce electronic equipment.
EM-4025АМ-3 Die Bonder is intended for eutectic, epoxy or soft solder bonding semiconductor chips and components in production of ICs, hybrids, diode and transistor arrays, microwave devices, and other multichip devices.
The EM-4075A-1 Die Bonder is designed for bonding semiconductor chips in production of integrated circuits, hybrids, UHV-transistors, diode and transistor assemblies and other electronic devices by vibration eutectic soldering in manual mode.