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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

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Equipment for wafer pattern generation and inspection

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Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


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Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

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Microelectronics Microscopes

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Automatic VLSI Placement System EM-4138

EM-4138 Automatic VLSI Placement System is intended for automatic inspection, pickup of good dice from semiconductor wafers and placement into cassettes Gel-Pak.

Good dice are detected by means of a high speed and high precision pattern recognition system.

High speed drives with feedback are used for wafer orientation, eject mechanisms, die pick up and placement into cassettes.

The system provides autodiagnostics of main electronic and mechanical units.

Throughput 6000 dice/hour
Wafer diameter up to 200 mm
Number of placement tools 1
Number of simultaneously filled cassettes 8
Cassette size 2x2''
Power consumption and requirements 230 V, 50 Hz, 1 kW
Overall dimensions 1120x850x1750 mm
Weight 400 kg
Die size from 0.8x0.8 15x15 mm

Russian version
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