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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems
EM-4138

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Automatic VLSI Placement System EM-4138


EM-4138 Automatic VLSI Placement System is intended for automatic inspection, pickup of good dice from semiconductor wafers and placement into cassettes Gel-Pak.

Good dice are detected by means of a high speed and high precision pattern recognition system.

High speed drives with feedback are used for wafer orientation, eject mechanisms, die pick up and placement into cassettes.

The system provides autodiagnostics of main electronic and mechanical units.

Throughput 6000 dice/hour
Wafer diameter up to 200 mm
Number of placement tools 1
Number of simultaneously filled cassettes 8
Cassette size 2x2''
Power consumption and requirements 230 V, 50 Hz, 1 kW
Overall dimensions 1120x850x1750 mm
Weight 400 kg
Die size from 0.8x0.8 15x15 mm

Russian version
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