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EM-4138

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Automatic VLSI Placement System EM-4138


EM-4138 Automatic VLSI Placement System is intended for automatic inspection, pickup of good dice from semiconductor wafers and placement into cassettes Gel-Pak.

Good dice are detected by means of a high speed and high precision pattern recognition system.

High speed drives with feedback are used for wafer orientation, eject mechanisms, die pick up and placement into cassettes.

The system provides autodiagnostics of main electronic and mechanical units.

SPECIFICATIONS
Throughput 6000 dice/hour
Wafer diameter up to 200 mm
Number of placement tools 1
Number of simultaneously filled cassettes 8
Cassette size 2x2''
Power consumption and requirements 230 V, 50 Hz, 1 kW
Overall dimensions 1120x850x1750 mm
Weight 400 kg
Die size from 0.8x0.8 15x15 mm

Russian version
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