EM Wafer Washing System is designed for wafer washing with water-air jet and wafer drying after dicing.
The system uses jet hydrodynamic cleaning, which means that water mixed with the compressed air jet is aimed at the surface being cleaned. The controller, used in the system, made by Mitsubishi Electric provides for three modes of the system:
- Automatic – washing+drying
Deionized water is used as the cleaning solution.
Drying is carried out in the cleaned warmed compressed air or inert gas jet due to centrifugal effect with the wafer spinning up to 3000 turns/minute. Depending on the mode the controller gives analogous task of centrifuge spinning speed as well as stepper control impulses with the chosen speed and acceleration.
The system is floor-mounted with its own amortization.