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EM-2048A
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EM-3027A
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Wafer Washing System EM-3027A


EM-3027 WAFER WASHER

EM Wafer Washing System is designed for wafer washing with water-air jet and wafer drying after dicing.

The system uses jet hydrodynamic cleaning, which means that water mixed with the compressed air jet is aimed at the surface being cleaned. The controller, used in the system, made by Mitsubishi Electric provides for three modes of the system:

- Washing

- Drying

- Automatic washing+drying

Deionized water is used as the cleaning solution.

Drying is carried out in the cleaned warmed compressed air or inert gas jet due to centrifugal effect with the wafer spinning up to 3000 turns/minute. Depending on the mode the controller gives analogous task of centrifuge spinning speed as well as stepper control impulses with the chosen speed and acceleration.

The system is floor-mounted with its own amortization.

 

SPECIFICATIONS

Max. diameter of processed wafers 200mm
Time setting range for cleaning 10 to 150 sec
Time setting range for drying 10 to 150 sec
Centrifuge rotation frequency 500 to 3000 rpm
Compressed air pressure 0,5 to 06 MPa
Compressed air consumption, max 3 m3/hour
DI water pressure 0.2 to 0.3 MPa
DI water consumption 100 l/hour
Vacuum manifold with rest pressure 0.4 MPa
Power requirements and consumed power 230V, 50Hz, 1.2 kW
Overall dimensions 600 x500 x 1250mm
Weight, not more than 100 kg

Russian version
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