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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

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Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


Semiautomatic Wafer Dicing Saw EM-225

EM-225M Semiautomatic Wafer Dicing Saw is designed for through-cutting or notching of semiconductor wafers made of silicon, GaAs, policor, ceramics, etc. into rectangular dices; dividing of glass, glass-ceramic, policor and other substrates with the help of a special diamond wheel.

Operator-inspected wafer alignment and cutting quality is assisted by an optical TV system.

The object table provides for fixing the wafer on the plate, rotating in automatic or set mode by 90 with the minimum discrete turn 12 seconds of angle.

Spindle with abrasive disk together with television microscope moves by up to 150 mm with the minimal discretion 0.01. Accumulated accuracy on Y axis is 0.02 mm.

Wafer diameter 76, 100, 150 mm
Object table length feed speed on X axis from 0,5 to 100 mm/s
- with discretion 0,5 mm/s
Programmed travel of the object table on Z axis to 6 mm
- with discretion 0,001 mm
Spindle step on Y axis (0,01 150) mm
-with discretion 0,001 mm
Minimal discretion of the table turn drive 12 sec of angle
Spindle revolution range (14 000 60 000) rpm^(-1)
Output capacity on the electrospindle roller 1,2 kW
Compressed air from 0,5 to 0,6 MPa
Compressed air consumption 10 m^3/hour
Water from 0,20 to 0,3 MPa, 10 l/min
Overall size 1200x1200x1500 mm
Weight 300 kg
Power consumption, max 2kW

Russian version
Planar Holding
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