EM-2085B Wafer Dicing Saw

EM-2085B semiautomatic dicing saw is intended for cutting of semiautomatic wafers with the diameter up to 200 mm and the thickness up to 3 mm.

EM-2085B is based on the highly-precision systems, which provide the high accuracy of movements.

The semiautomatic dicing saws is equipped with feedback sensors on X, Y, Z drives; non-contact system for cutting depth control and dicing blade wearing, expanded processor memory, closed cutting zone, providing more reliable, simple and comfort work.

The semiautomatic dicing saw ensures the diagnostics of main functioning units with the output on LCD.

SPECIFICATIONS The diameter of the processed wafers 76, 100, 150, 200 mm Power electrospindle 1,2 kW Shaft speed electrospindle from 14000 to 60000 rpm Max electrospindle movement on the Y axis 250 mm The maximum displacement of the table object on the X axis 300 mm The maximum displacement along the Z axis 24 mm The range of adjustment of the working table feed object in the X from 0,1 to 400 mm/s Control range indexing electrospindle Y-axis from 0,01 to 250 mm Accumulated error indexing electrospindle Y axis over a length of 210 mm 0,004 mm Reproducibility electrospindle movement along the Z axis to a length of 8 mm 0,005 mm The volume flow of compressed air (at 0.5 MPa) 12 m3 / h Compressed air pressure 0.5-0.6 MPa Vacuum from 0,04 to 0,03 MPa Overall dimensions 970x950x1400 mm