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EM-2085B Wafer Dicing Saw
EM-2085B semiautomatic dicing saw is intended for cutting of semiautomatic wafers with the diameter up to 200 mm and the thickness up to 3 mm.
EM-2085B is based on the highly-precision systems, which provide the high accuracy of movements. The semiautomatic dicing saws is equipped with feedback sensors on X, Y, Z drives; non-contact system for cutting depth control and dicing blade wearing, expanded processor memory, closed cutting zone, providing more reliable, simple and comfort work.
The semiautomatic dicing saw ensures the diagnostics of main functioning units with the output on LCD.
SPECIFICATIONS
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| The diameter of the processed wafers, mm |
76, 100, 150, 200 ìì |
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| Power electrospindle, kW |
1,2 |
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| Shaft speed electrospindle, min-1 |
from 14000 to 60000 |
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| Max electrospindle movement on the Y axis, mm |
250 |
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| The maximum displacement of the table object on the X axis, mm |
300 |
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| The maximum displacement along the Z axis, mm |
24 |
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| The range of adjustment of the working table feed object in the X mm/s |
from 0,1 to 400 |
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| Control range indexing electrospindle Y-axis, mm |
from 0,01 to 250 |
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| Accumulated error indexing electrospindle Y axis over a length of 210 mm |
0,004 |
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| Reproducibility electrospindle movement along the Z axis to a length of 8 mm |
0,005 |
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| The volume flow of compressed air (at 0.5 MPa), m3 / h |
12 |
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| Compressed air pressure, MPa |
05-06 |
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| Vacuum |
from 0,04 to 0,03 MPa |
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| Overall dimensions, mm |
970x950x1400 |
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