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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws
EM-2048A
EM-2058
EM-2115
EM-2085B
EM-225M
EM-3027A
DAR6
DAR9
DAR10
DAR9N

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

DAR9 Diamond Dicing Wheels


Diamond Dicing Wheels with multilayer diamond  cutting edge deposited on aluminum body with nickel binder by electrolytic method are intended for dicing wafers made of materials used in microelectronics

The inner wheel layer provides for enduring quality and high productivity, the outer layers provide for the high cut quality. Standard fitting and outer diameters allow using wheels on any dicing equipment.

SPECIFICATIONS

Outer diameter, mm 56,0;
Inner diameter, fitting, mm 19,05
Material to be cut Silicon, GaAs, GaP, GaAsP.

Specification by grit size

Grit Size of multiple layers blade Marking Material to be cut
0,5/2 - 4/2 - 0,5/2 Ga As; Ga P
0,5/2 6/4 0,5/2 Si; Ga As; Ga P
4/2 6/4 4/2 Si
Example:

DAR9-30.750 A

DAR9 30.750 CA
Type Marking Grit Size
Note:

         We can also deliver wheels meeting your special requirements to main parameters and material to be cut.

You can order a trial lot of diamond dicing wheels for testing under your manufacturing process.

 

 

Blade types DAR9

Russian version
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