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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws
EM-2048A
EM-2058
EM-2115
EM-2085B
EM-225M
EM-3027A
DAR6
DAR9
DAR10
DAR9N

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

DAR9 Diamond Dicing Wheels


Diamond Dicing Wheels with multilayer diamond cutting edge deposited on aluminum body with nickel binder by electrolytic method are intended for dicing wafers made of materials used in microelectronics

The inner wheel layer provides for enduring quality and high productivity, the outer layers provide for the high cut quality. Standard fitting and outer diameters allow using wheels on any dicing equipment.

SPECIFICATIONS
Outer diameter, mm 56,0;
Inner diameter, fitting, mm 19,05
Material to be cut Silicon, GaAs, GaP, GaAsP.
SPECIFICATION BY GRIT SIZE
Grit Size of multiple layers blade Marking Material to be cut
0,5/2 - 4/2 - 0,5/2 Ga As; Ga P
0,5/2 6/4 0,5/2 Si; Ga As; Ga P
4/2 6/4 4/2 Si

Example: DAR9-30.750 A
DAR9 30.750 CA
Type Marking Grit Size

Note:
We can also deliver wheels meeting your special requirements to main parameters and material to be cut.
You can order a trial lot of diamond dicing wheels for testing under your manufacturing process.

Blade types DAR9


Russian version
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