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Equipment for mask pattern generation and inspection

Multichannel laser generators

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Equipment for wafer pattern generation and inspection


Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment


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Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

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IC Pretreatment Equipment

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Microscopy, Optical Components


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The EM-2115 Semiautomatic substrate’s separation

The EM-2115 Semiautomatic Substrate Separation System is intended for double-setting separation of semiconducting wafers and substrates on the frame type satellite with an outer diameter 294 mm and with thickness 1,6 mm. Ñutting of substrates and wafers is performed with microabrasive special tool.

Processed material – silicon, gallium arsenide, piezoquartz, lithium niobate, lithium tantalite, langasite, langalat, solids.

The system’s feature is using two independently positioned high-precision electrospindles, what provides simultaneous substrate’s separation by two different and two identical instruments.

The Semiautomatic make diagnostics of Actuation Systems and issuance of operational information on the LCD monitor.

For better separation of super hard materials and to increase productivity the system provides for the possibility of multistage separation.

Diameter of the processed semiconducting wafers, mm 76, 100, 150, 200
Quantity of the installed electrospindle, pieces 2
Power of electrospindle, kW 1.2
Spindle revolutions range, rpm from 14000 to 60000
The maximum movement of electrospindle on Y axis, mm 270
The maximum movement of subject table on Y axis, mm 320
The maximum movement of electrospindle on Z axis, mm 24
Range of control of subject table’s working feed on X axis, mm /ñ from 0.1 to 200 with discrete 0,1
Range of control of electrospindle’s stepper motion on Y axis, mm from 0.01 to 270 with discrete 0,001
Accumulated error of electrospindle’s stepper motion on Y axis over a length 210 mm, mm 0.005
The reproducibility of electrospindle’s motion on Z axis over a length 8 mm, mm 0.005
Volumetric flow rate of compressed air (at a pressure of 0,5 MPa), m3/h 25
Pressure of compressed air, MPa 0.5-0.6
Vacuum from 0.04 to 0.03 MPa
Overall dimensions (l×w×h), mm 1200×1050×1700

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