Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services R&D Support


Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws
EM-2048A
EM-2058
EM-2115
EM-2085B
EM-225M
EM-3027A
DAR6
DAR9
DAR10
DAR9N

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

The EM-2115 Semiautomatic substrate’s separation


The EM-2115 Semiautomatic Substrate Separation System is intended for double-setting separation of semiconducting wafers and substrates on the frame type satellite with an outer diameter 294 mm and with thickness 1,6 mm. Ñutting of substrates and wafers is performed with microabrasive special tool.

Processed material – silicon, gallium arsenide, piezoquartz, lithium niobate, lithium tantalite, langasite, langalat, solids.

The system’s feature is using two independently positioned high-precision electrospindles, what provides simultaneous substrate’s separation by two different and two identical instruments.

The Semiautomatic make diagnostics of Actuation Systems and issuance of operational information on the LCD monitor.

For better separation of super hard materials and to increase productivity the system provides for the possibility of multistage separation.

Diameter of the processed semiconducting wafers, mm 76, 100, 150, 200
Quantity of the installed electrospindle, pieces 2
Power of electrospindle, kW 1.2
Spindle revolutions range, rpm from 14000 to 60000
The maximum movement of electrospindle on Y axis, mm 270
The maximum movement of subject table on Y axis, mm 320
The maximum movement of electrospindle on Z axis, mm 24
Range of control of subject table’s working feed on X axis, mm /ñ from 0.1 to 200 with discrete 0,1
Range of control of electrospindle’s stepper motion on Y axis, mm from 0.01 to 270 with discrete 0,001
Accumulated error of electrospindle’s stepper motion on Y axis over a length 210 mm, mm 0.005
The reproducibility of electrospindle’s motion on Z axis over a length 8 mm, mm 0.005
Volumetric flow rate of compressed air (at a pressure of 0,5 MPa), m3/h 25
Pressure of compressed air, MPa 0.5-0.6
Vacuum from 0.04 to 0.03 MPa
Overall dimensions (l×w×h), mm 1200×1050×1700

Russian version
PLANAR
Planar Corporation
Site Search
 

© 2003 Planar
e-mail: planar@solo.by

www.redgraphic.com Web design and
development