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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws
EM-2048A
EM-2058
EM-2115
EM-2085B
EM-225M
EM-3027A
DAR6
DAR9
DAR10
DAR9N

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Dicing Saws


EM-2048

The system is intended for the creation of the frame type sattelite on the adhesive carrier with the purpose of subsequent though cuttting and creation of sattelites for die placement on inspection systems.

EM-2058

EM-2058 System for Wafer Placement on Adhesive Carrier is designed to place semiconductor wafers made of silicium, gallium arsenide, etc. on protective adhesive film (with or without a protective layer) with metal frame FF-105 before a through dicing.

EM-2115

The EM-2115 Semiautomatic substrate’s separation is intended for double-setting separation of semiconducting wafers and substrates on the frame type satellite with an outer diameter 294 mm and with thickness 1,6 mm. Сutting of substrates and wafers is performed with microabrasive special tool.

EM-2085

EM-2085B semiautomatic dicing saw is intended for cutting of semiautomatic wafers with the diameter up to 200 mm and the thickness up to 3 mm.

EM-225M 

EM-225M Semiautomatic Wafer Dicing Saw is designed for through-cutting or notching of semiconductor wafers made of silicon, GaAs, , policor, ceramics, etc. into rectangular dices; dividing of glass, glass-ceramic, policor and other substrates with the help of a special diamond wheel.

EM-3027A

EM Wafer Washing System is designed for wafer washing with water-air jet and wafer drying after dicing.

DAR-6

Wheels with diamond dicing blade are used for cutting of various substrates used in microelectronics. DAR6 dicing wheels are manufactured with the diamond grit with the size from 0/2 to 40/28

DAR-9 

Diamond Dicing Wheels with multilayer diamond  cutting edge deposited on aluminum body with nickel binder by electrolytic method are intended for dicing wafers made of materials used in microelectronics

DAR-10

Diamond Dicing Wheels with multilayer diamond  cutting edge deposited on aluminum body with nickel binder by electrolytic method are intended for dicing wafers made of materials used in microelectronics


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