Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services Support


Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders

Dicing Saws
EM-2048A
EM-2058
EM-2115
EM-2085B
EM-225M
EM-3027A
DAR6
DAR9
DAR10
DAR9N

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

Dicing Saws


EM-2048A

The system is intended for the creation of the frame type sattelite on the adhesive carrier with the purpose of subsequent though cuttting and creation of sattelites for die placement on inspection systems.

EM-2058

EM-2058 System for Wafer Placement on Adhesive Carrier is designed to place semiconductor wafers made of silicium, gallium arsenide, etc. on protective adhesive film (with or without a protective layer) with metal frame FF-105 before a through dicing.

EM-2115

The EM-225 Semiautomatic substrate’s separation is intended for double-setting separation of semiconducting wafers and substrates on the frame type satellite with an outer diameter 294 mm and with thickness 1,6 mm. Сutting of substrates and wafers is performed with microabrasive special tool.

EM-2085B

EM-2085B semiautomatic dicing saw is intended for cutting of semiautomatic wafers with the diameter up to 200 mm and the thickness up to 3 mm.

EM-225M

EM-225M Semiautomatic Wafer Dicing Saw is designed for through-cutting or notching of semiconductor wafers made of silicon, GaAs, policor, ceramics, etc. into rectangular dices; dividing of glass, glass-ceramic, policor and other substrates with the help of a special diamond wheel.

EM-3027A

EM Wafer Washing System is designed for wafer washing with water-air jet and wafer drying after dicing.

DAR-6

Wheels with diamond dicing blade are used for cutting of various substrates used in microelectronics. DAR6 dicing wheels are manufactured with the diamond grit with the size from 0/2 to 40/28

DAR-9

Diamond Dicing Wheels with multilayer diamond cutting edge deposited on aluminum body with nickel binder by electrolytic method are intended for dicing wafers made of materials used in microelectronics

DAR-10

Diamond Dicing Wheels with multilayer diamond cutting edge deposited on aluminum body with nickel binder by electrolytic method are intended for dicing wafers made of materials used in microelectronics


Russian version
PLANAR
Planar Holding
Site Search
 

© 2003 Planar
e-mail: planar_ovep@kbtem.by

www.redgraphic.com Web design and
development