Chemical wafer grinder EM-3047
EM-3047 Chemical Wafer Grinder is intended for elimination of surface traction and the damaged silicium layer after the mechanical wafer grinding with the subsequent washing and drying.
The system is designed in compliance with the global practice of the analogical chemical wafer grinders.
Using the control system it is possible to change the basic parameters of the equipment for each mode: for corrosion, washing and drying.
The system provides automatic wafer loading-unloading.
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| Corrosion parameters: |
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| time regulation diapason |
10-200 sec |
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| centrifuge rate of rotation regulation diapason |
0-400 turn/min |
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| Washing and drying parameters: |
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| time regulation diapason |
10-200 sec |
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| centrifuge rate of rotation regulation diapason |
500-1000 turn/min |
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| Wafer diameter |
100, 150, 200 mm |
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| Acid proof water drain with throughput capacity |
0.12 m3/hour |
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| Acid proof ventilation system |
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| Power requirements |
220 V, 50 Hz |
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| Overall dimensions |
1750×850×2250 mm |
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