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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

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Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders
EM-3047
EM-2060
EM-2070
EM-2080
UN-1
UU-1

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

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IC Pretreatment Equipment

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Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Chemical wafer grinder EM-3047


EM-3047 Chemical Wafer Grinder is intended for elimination of surface traction and the damaged silicium layer after the mechanical wafer grinding with the subsequent washing and drying.

The system is designed in compliance with the global practice of the analogical chemical wafer grinders.

Using the control system it is possible to change the basic parameters of the equipment for each mode: for corrosion, washing and drying.

The system provides automatic wafer loading-unloading.

Corrosion parameters:
time regulation diapason 10-200 sec
centrifuge rate of rotation regulation diapason 0-400 turn/min
Washing and drying parameters:
time regulation diapason 10-200 sec
centrifuge rate of rotation regulation diapason 500-1000 turn/min
Wafer diameter 100, 150, 200 mm
Acid proof water drain with throughput capacity 0.12 m3/hour
Acid proof ventilation system
Power requirements 220 V, 50 Hz
Overall dimensions 1750×850×2250 mm

Russian version
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