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Equipment for mask pattern generation and inspection

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Wafer Grinders
EM-3047
EM-2060
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EM-2080
UN-1
UU-1

Dicing Saws

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IC Pretreatment Equipment

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Molds

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System for Finish Grinding EM-2080


System for finish grinding EM-2080 is intended for substrate finish grinding and grinding of the precision elements of micro system equipment (further on wafers).

Two-spindle with large loading capacity.

 

Wafer diameter is up to150 mm:

- 4 wafers with diameter 150 mm;

- 6 wafers with diameter 100 mm;

8 wafers with diameter 76 mm.

 

Object table is on aerostatic axial bearing.

Table rotation frequency is up to 60 rpm.

Material removal intensity is up to 2 mkm/s.

Comparative characteristics of machines EM-2060, EM-2070, EM-2080

Feature installation

-2060

-2070

-2080

1. Brief description

Duplex,
universal,
for plates up to Ø 200 mm,
1 plate in the center of the table

Spindle,
performance, compact,
for plates up to Ø 300 mm,
1 plate in the center of the table

Duplex,
productive,
with large amounts of load,
for plates up to Ø 150 mm,
group of plates on the table

2. Number of electric spindle, pieces

2

1

2

3. Rated power Electrospindle, kW

4,2

4,5

3

4. Spindle revolutions range, rpm

5000

4500

4500

5. Tool diameter of the ring gear, mm

195

195

195

6. Table rotation speed, r / min

120

300

60

7. Bearing thrust in the table Subject

roll-on

aerostatic

aerostatic

8. Readability positioning along the Z axis, mkm

0,1 (table)

0,08 (tool)

0,08 (tool)

9. Grinding mode

progressive
(tool covers
all plate - for plate up Ø 150 mm) ,
with rotation plate
(tool passes through the center of the plate),
combined

with rotation plate
(tool passes through the center of the plate)

sustained conditionally
with rotation
( instrument covers the whole
group of plates)

10. Type of protection against collisions with the tool table

software

hardware ( adjustable stops
and tips) + software

hardware ( adjustable stops
and tips) + software

11. Diameter of processed wafers, mm

100,150,200

100,150,200,
300 - optional

76,100, 150

12. Number plates on the table, pieces

1

1

8-76 mm, 6-100 mm, 4-150mm

13. Initial plate thickness (packets) mm, no more

2

5

5

14.Residual thickness processed wafers Si, mkm, at least

100

100
(when the instrument grit
20/10)

75

15. Thickness variation processed wafer, mkm

3 for Ø 100 mm
4 for Ø 150 mm
5 for Ø 200 mm

3 for Ø 100 mm
4 for Ø 150 mm
5 for Ø 200 mm

3 for Ø 76 mm
4 for Ø 100 mm
6 for Ø 150 mm

16. Thickness variation from wafer to wafer, mkm

3 for Ø 100 mm
4 for Ø 150 mm
5 for Ø 200 mm

3 for Ø 100 mm
4 for Ø 150 mm
5 for Ø 200 mm

3 for Ø 76 mm
4 for Ø 100 mm
6 for Ø 150 mm

17. The intensity of material removal, mkm / s, not more than

1,5

3

1 - for group plate

18. Surface finish/ roughness of the treated surface, Ra, mkm

0,035

0,035
( when the instrument grit 6/4)

0,035

19. Loading and unloading of plates

handmade by capturing
Bernoulli,
automatic - optional

handmade by capturing
Bernoulli

handmade by capturing
Bernoulli

20. Overall dimensions, mm, length width x height

250012501500

112515002320

200020002320

21. Weight, kg, not more than

2500

2000

3200

22. The electric power consumption, kW, not more

5

5

4


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