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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

Probers

Wafer Grinders
EM-3047
EM-2060
EM-2070
EM-2080
UN-1
UU-1

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy

Microelectronics Microscopes

Material Science

Biology

Medical Equipment

Cardiology

Wafer Grinders

English MainProductsChip Preparation Equipment › Wafer Grinders

EM-3047

EM-3047 Chemical Wafer Grinder is intended for elimination of surface traction and the damaged silicium layer after the mechanical wafer grinding with the subsequent washing and drying.

EM-2060

The mechanical Wafer Grinder EM-2060 is intended for deep double-phase grinding of wafers, other side of which is protected by the adhesive film, with following cleaning and drying of tooled wafers.

EM-2070

The system of substrate’s precision polishing EM-2070 is intended for polishing wafers, other side of which is protected by the adhesive film.

EM-2080

System for finish grinding EM-2080 is intended for substrate finish grinding and grinding of the precision elements of micro system equipment (further on wafers).

UN-1

UN-1 Protective Film Applicator is designed for mechanical application of protection (adhesive film) on planar side of wafers. Bubble-free lamination of the adhesive film to the water is quaranteed.

UU-1

UU-1 Protective Film Remover is designed to remove adhesive film from the planar side of a wafer


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