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Equipment for mask pattern generation and inspection

Multichannel laser generators

Pattern generators

Automatic mask inspection

Photomask inspection

Laser-based mask defect repair systems

Photorepeaters

Equipment for wafer pattern generation and inspection

Steppers

Large-area steppers

Pattern generator for wafers

Mask Aligners

Inspection of wafers and substrates

Chip Preparation Equipment

Probers

Wafer Grinders
EM-3047
EM-2060
EM-2070
EM-2080
UN-1
UU-1

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment

Microscopy, Optical Components

Microscopes

Optical Components

Medical Equipment

Cardiology

Reanimation and intensive care

Surgery and trauma

Physiotherapy, neurology

Molds, Linear Step Motors, Sensors

Molds

Linear Step Motors

Step Motors, Sensors

Wafer Grinders

English MainProductsChip Preparation Equipment › Wafer Grinders

EM-3047

EM-3047 Chemical Wafer Grinder is intended for elimination of surface traction and the damaged silicium layer after the mechanical wafer grinding with the subsequent washing and drying.

EM-2060

The mechanical Wafer Grinder EM-2060 is intended for deep double-phase grinding of wafers, other side of which is protected by the adhesive film, with following cleaning and drying of tooled wafers.

The machine is able to process silicic wafers under d200 mm, wafers of materials of A3B5 group, sapphire substrates, at the same time the system guarantees the receipt of minimal residual thickness of grinded wafers. The system’s construction guarantees firm protectability from external and internal sources of rumble, constant geometric parameters in polishing process during long product term of exploitation.

 

EM-2070

The system of substrate’s precision polishing EM-2070 is intended for polishing wafers, other side of which is protected by the adhesive film.

EM-2080

System for finish grinding EM-2080 is intended for substrate finish grinding and grinding of the precision elements of micro system equipment (further on wafers).

 

UN-1 

UN-1 Protective Film Applicator is designed for mechanical application of protection (adhesive film) on planar side of wafers. Bubble-free lamination of the adhesive film to the water is quaranteed.

UU-1

UU-1 Protective Film Remover is designed to remove adhesive film from the planar side of a wafer

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