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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

EM-6520, EM-6520-1
Probe Cards

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


EM-6520, EM-6520-1 Semiautomatic Probers

English MainProductsChip Preparation EquipmentProbers › EM-6520, EM-6520-1

EM-6520, E-6520-1 Semiautomatic Probers are designed for contacting of IC and VLSI on wafers with the diameter 200 mm in the range of normal and high temperatures.

The probes provide:
 electrical contact between probes and contact pads of chips on wafer;
 wafer tracing according to the traditional line by line method and through the basic points programmed relatively to the basic die;
 yield mapping of test results;
 output of the test results on the display;
 output of the test results on the periphery device;
 die marking with ink.

The electronic devices and software ensure teaching from another device directly on the system, the parameters being saved in systems memory, for work under conditions of multinomenclate production.

Wafer dimeter, max 200 mm
Die size, max 2020 mm
Contact accuracy 10 mkm
Object table heating temperature (E-6520) up to 150
Vacuum 0.04-0.03 MPa
Power consumption and requirements 230 V, 50 Hz, 0.8 W
Overall dimensions, max 8007001600 mm
Weight, max 300 kg

Russian version
Planar Holding
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