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Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment

EM-6520, EM-6520-1
Probe Cards

Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


Analytical Submicron Prober EM-6070

The EM-6070A Submicron Prober is intended to ensure electrical contact between probes and semiconductor chip pattern elements and metalized buses of micron and submicron sizes, to provide visual inspection of structures as well as to localize certain features during diagnostics of internal IC block condition under normal and high temperature ranges.

The EM-6070A is top desk.

Wafer diameter up to 200 mm
Dice Size (0.40.4) (20x20) mm
Minimal size of element to be contacted 0.8 mkm
Micromanipulator travel on X, Y, Z 10 mm
Micromanipulator sensitivity 250 mkm/turn
Fine tuning sensitivity 20 mkm/turn
Travel with fine turning 200 mkm
Micromanipulator fixing to the platform permanent magnet
Object table heating temperature 50150C
Microscope magnification 20^Յ2000^
Power requirements ~220 V, 50 Hz
Power consumption, max 0.8 kW
Vacuum with residual pressure 0.04MPa

Russian version
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