 |
Visual inspection and automated wafers dice marking station MK-AM

The MK-AM system is intended for visual die inspection of IC, using a microscope, with the aim of finding bad dice on the wafers and marking them automatically. The following procedures are made on the system: à) Wafer loading and unloading - manually; b) Preliminary wafer orientation within ±5° (manually, with the help of a special key) with the following automatic correction of the wafer orientation rest error (if necessary) through the coordinate table during wafer inspection; c) Stage positioning along Õ,Y – according to program or manually via the joystick; d) Microscope magnification change – from the microscope control panel; e) Focussing – manually; f) Bad die marking is made one by one after finding defect dice or automatically after completing inspection of the whole wafer.
Diameter of wafers being processed, mm |
100; 150; 200 |
Microscope magnification |
100; 200; 500 |
Automatic object stage: |
|
- stage travel along X-Y, mm, not less than |
283x204 |
- displacement error, mm |
±0.03 |
- displacement discreteness, mm |
0.005 |
- travel speed, mm |
0.5 ... 40 |
Size of defects being detected, µm, not less |
0.8 |
Displacement of marking spot relatively to the die center, mm, not more than |
0.2 |
Power consumption, W |
500 |
Power supply |
~ 230V, 50Hz |
Overall dimensions, mm |
1300x1200x1400 |
Weight, kg |
150 |

|
 |