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Visual inspection and automated wafers dice marking station MK-AM
The MK-AM system is intended for visual die inspection of IC, using a microscope, with the aim of finding bad dice on the wafers and marking them automatically.
The following procedures are made on the system:
à) Wafer loading and unloading - manually;
b) Preliminary wafer orientation within ±5° (manually, with the help of a special key) with the following automatic correction of the wafer orientation rest error (if necessary) through the coordinate table during wafer inspection;
c) Stage positioning along Õ,Y – according to program or manually via the joystick;
d) Microscope magnification change – from the microscope control panel;
e) Focussing – manually;
f) Bad die marking is made one by one after finding defect dice or automatically after completing inspection of the whole wafer.
| Diameter of wafers being processed, mm |
100; 150; 200 |
| Microscope magnification |
100; 200; 500 |
| Automatic object stage: |
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| - stage travel along X-Y, mm, not less than |
283x204 |
| - displacement error, mm |
±0.03 |
| - displacement discreteness, mm |
0.005 |
| - travel speed, mm |
0.5 ... 40 |
| Size of defects being detected, µm, not less |
0.8 |
| Displacement of marking spot relatively to the die center, mm, not more than |
0.2 |
| Power consumption, W |
500 |
| Power supply |
~ 230V, 50Hz |
| Overall dimensions, mm |
1300x1200x1400 |
| Weight, kg |
150 |
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