Main   Site Map   Contact   Feedback   Useful Links  
About Planar Products Services Support

Equipment for mask pattern generation and inspection

Precision pattern generators

Special application pattern generator

Automatic mask inspection

Systems for inspection of work masks

Laser-based mask defect repair systems


Equipment for wafer pattern generation and inspection

Equipment for wafer projection imaging

Large-area steppers

Equipment for direct writing on wafers

Tools for proximity exposure and double-side lithography

Wafer inspection equipment

Chip Preparation Equipment


Wafer Grinders

Dicing Saws

Die Control and Cassetting Systems

Assembly and Packaging Equipment, Laser Processing

Die Bonders

Wire Bonders

Wafer Bonders

IC Pretreatment Equipment

Laser Processing Equipment


Microelectronics Microscopes

Material Science


Medical Equipment


Chip Preparation Equipment

English MainProducts › Chip Preparation Equipment

In this section you will find the equipment for various operations with semiconductor wafers prior to the assembly process itself - from wafer thinning (grinding) up to chip cassetting. For the reason of incoming testing of wafers before the assembly operations we found it expedient to show our probers here as well, which have been developed and produced by our company since 1964.

Equipment shown in this section has been produced by Planar Concern for many years but wafer grinders. As for the wafer grinders, in spite of certain novelty of this operation in the process flow of semiconductor industry, by now we have developed second generation of such equipment which is successfully used at foreign and CIS semiconductor manufacturers.

Wafer Grinders
Dicing Saws
Die Control and Cassetting Systems

Russian version
Planar Holding
Site Search

2003 Planar
e-mail: Web design and